TSA Technology

PCB Fabrication   
  Introduction
   Raw Material
   Resist Lamination
   Imaging Resist
   Exposed Resist
   Resist Developed
   Copper Etch
   Resist Stripped
   Material Lamination
   Drilled Hole

   Copper Deposition
   Resist Processing
   Copper Plating
   Tin Lead Plating
   Resist Stripping
   Copper Etch
   Tin Lead Strip
   SMOBC
   Hot Air Leveling

PCB Defects
   Drill Burr
   Delamination
   Deposition Void
   Drill Gouge
   Drill Smear
   Excess Desmear
   Reverse Etch Back
   Hole Pull Away
   Rim Void
   Material Void

   Back-Lit XS

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