PCB Lamination
In this step the inner layer is used in the center of a stack of material. Layers of copper with uncured fiberglass are added to the top and bottom of the inner layer. The stacked layers of material is then laminated in a press. The lamination process puts the stack under pressure and with temperatures that are high enough to bond all layers together. The bonding occurs as fiber glass is cured adhering the top and bottom layers to the core material.